Platinized Titanium Anodes for Copper Plating
Designed for precision copper plating, a platinized anode combines a titanium substrate with a platinum Plating, delivering reliable performance, corrosion resistance, and stable current distribution. Its insoluble nature ensures minimal contamination and consistent bath chemistry.
Why are platinized titanium anodes used in copper plating instead of copper anodes in some processes?
Platinized anodes are used when it is important to maintain strict control over copper ion concentration in the plating bath. Copper ions are added separately through chemical replenishment. This helps maintain stable bath composition, improved plating quality, and reduced contamination, especially in precision plating applications.
Technical Specifications of Platinized Anode
| Substrate (Base Material) |
Titanium |
| Platinum Plating Thickness |
2.5 µ to 5.0 µ |
| Platinum Purity |
99.9% |
| Plating Method |
Electroplating |
| Platinum Consumption Rate |
1.0 – 3.0 μg/Ah |
*Under nominal operating conditions.
Advantages of Platinized Anodes for Copper Plating
| Complete dimensional stability |
| Perfect thickness & uniformity |
| Eliminates Anode sludge and roughness |
| Maintenance free anode |
| No anode polarization at high speed plating |
| Improved surface smoothness |
| Tighter thickness tolerance in circuit layers |
| High current density capability |
| High speed plating reel to reel plating |
| Platinised titanium anode for copper plating is highly effective but limited to specific high temperature application like PCB and semiconductor packaging |